Fundamentals of Lead-Free Solder Interconnect Technology (book), Tae-Kyu Lee, Thomas Bieler, Choong-un Kim and Hongtao Ma, ISBN 978-1-4614-9266-5, Springer 2015

 

Lead Free solder, Encyclopedia of Materials: Science and Technology (Book Chapter), T.R. Bieler and Tae-Kyu Lee, 2010, 1-12, Elsevier

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Book Chapter: Lutz Meinshausen, Ming Liu, Indranath Dutta, Tae-Kyu Lee and Li Li, Semiconductor devices in harsh conditions (editor-in-chief, Kristen Weide-Zaage), Chapter 10: Role of diffusional interfacial sliding during temperature cycling and electromigration-induced motion of copper through silicon via, Taylor  &Francis CRC press (2016), pp.197-224, ISBN-13: 978-1498743808

 

Book Chapter: Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul Conway and Tae-Kyu Lee, Chapter 4: Microstructural and Reliability Issues of TSV, 3D Microelectronic Packaging (editor-in-chief: Yan Li and Deepak Goyal), Springer (New York), (2020) pp.71-99, ISBN 978-981-15-7089-6

 

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Scott Fuller, Mohamed Sheikh, Greg Baty, Choong-Un Kim, and Tae-Kyu Lee, Impact of in situ current stressing on Sn-based solder joint shear stability, Journal of Materials Science: Materials in Electronics(2020), online : https://doi.org/10.1007/s10854-020-05038-3

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Quan Zhou, Tae-Kyu Lee, and Thomas R. Bieler,  In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis, Materials Science & Engineering A 802 (2021) 140584

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Kirak Son, Gyu-Tae Park, Byeong-Rok Lee, Cheol-Woong Yang, Jeong Sam Han, Tae-Kyu Lee and Young-Bae Park, The impact of Electromigration induced Joule heating on Sn-Ag Microbump Reliability with difference UBM structures, Journal of Electronic Materials (JEM) 49(12), pp.7228-7237 (2020)

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Ande Kitamura, Timothy Matthews, Ruben Contreras, David Routledge, and Tae-Kyu Lee, Impact of cryogenic temperature environment on single solder joint mechanical shear stability, Journal of Electronic Materials (JEM), published 09152020, online: https://doi.org/10.1007/s11664-020-08456-5

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Mohamed Sheikh, Andy Hsiao, Weidong Xie, Steven Perng, and Tae-Kyu Lee, Localized multi-axis loading impact on interconnect thermal cycling performance in via-in pad plated over (VIPPO) board configuration, Journal of Electronic Materials (JEM), published 08272020, online: https://doi.org/10.1007/s11664-020-08409-y

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Hyodong Ryu, Kirak Son, Jeong Sam Han, Young-Bae Park, and Tae-Kyu Lee, The role of non-conductive film (NCF) on Cu/Ni/Sn-Ag Microbump interconnect Reliability, Journal of Materials Science: Materials in Electronics, vol.31 (2020) pp.15530-15538

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Andy Hsiao, Greg Baty, Edward Ibe, Karl Loh, Steven Perng, Weidong Xie, and Tae-Kyu Lee, Edgebond and Edgefill Induced Loading Effect on Large WLCSP Thermal Cycling Performance, Journal of Surface Mount Technology (JSMT), vol.22(2) (2020) pp.22-27

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Andy Hsiao, Mohamed Sheikh, Karl Loh, Edward Ibe, and Tae-Kyu Lee, Impact of conformal coating induced stress on wafer level chip scale package thermal cycling performance, Journal of Surface Mount Technology (JSMT), vol.22(2) (2020) pp.7-13

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Tae-Kyu Lee, Weidong Xie, Michael Tsai, and Mohamed Sheikh, Impact of microstructure evolution on the long-term reliability of wafer-level chip-scale package Sn-Ag-Cu solder interconnects, IEEE Transactions on Components and Packaging and Manufacturing Technology (IEEE CPMT), vol.10(10) (2020) pp.1594-1603

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Hanry Yang, Tae-Kyu Lee, Lutz Meinshausen and Indranath Dutta, Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias, Journal of Electronic Materials (JEM), vol.48(11) (2019) pp.159-169

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Tae-Kyu Lee, Zhiqiang Chen, Cherif Guirguis and Kola Akinade, Impact of isothermal aging and testing temperature on Large Flip-chip BGA interconnect mechanical shock performance, Journal of Electronic Materials (JEM), vol.46(10) (2017) pp.6224-6233

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Tae-Kyu Lee, Zhiqiang Chen, Greg Baty, Thomas R. Bieler, and Choong-Un Kim, Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance, Journal of Electronic Materials, vol.45(12) (2016) pp.6177-6183

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Quan Zhou, Bite Zhou, Tae-Kyu Lee and Thomas R. Bieler, Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling, Journal of Electronic Materials, 45(6) (2016) pp.3013-3024

 

Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler, Impact of cooling rate on low silver Sn-Ag-Cu solder interconnect board level mechanical shock and thermal cycling performance, Journal of Electronic Materials, 45 (1), 2016, 172-182

 

Christine Jill Lee,  Wei-Yu Chen, Tzu-Ting Chou, Tae-Kyu Lee, Yew-Chung Wu,  Tao-Chih Chang, Jenq-Gong Duh, The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test, Journal of Materials Science : Mater Electron, 26, 2015, 10055-10061

 

Bite Zhou, Quan Zhou, Thomas R. Bieler and Tae-kyu Lee, Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages, Journal of Electronic Materials, 44 (3), 2015, 895-908

 

Tae-Kyu Lee, and Weidong Xie, Effect of board thickness on Sn-Ag-Cu joint interconnect Thermal cycling and Dynamic shock performance, Journal of Electronic Materials, 43 (12), 2014, 4522-4531

 

Tae-Kyu Lee and Jeng-Gong Duh, Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn–Ag–Cu and Sn–Ag Solder Interconnects With and Without Board-Side Ni Surface Finish, Journal of Electronic Materials,           43(11), 2014, 4126-4133

 

Payam Darbandi, Farhang Pourboghrat, Thomas R. Bieler, Tae-kyu Lee, The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests, Journal of Electronic Materials, 43(7), 2014, 2521-2529

 

Payam Darbandi, Tae-Kyu Lee, Thomas Bieler, Farhang Pourboghrat, Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints, Computational Materials Science, 85(4), 2014, 236-243

 

Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler, Influence of high G mechanical shock and thermal cycling on localized recrystallization in Sn-Ag-Cu solder interconnects, Journal of Electronic Materials, 43(1), 2014, 69-79

 

Choong-Un Kim, Woong-Ho Bang, Huili Xu, and Tae-Kyu Lee, Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing, Journal of Metals (JOM), 65(10), 2013, 1362-1373

 

Tae-Kyu Lee,   Impact of electrical current on the long term reliability of fine pitch ball grid array packages with Sn-Ag-Cu solder interconnects, Journal of Electronic Materials, 42(4), 2013, 599-606

 

Payam Darbandi, Thomas Bieler, Farhang Pourboghrat and Tae-Kyu Lee, Crystal Plasticity Finite Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints, Journal of Electronic Materials,         42(2), 2013, 201-214

 

Bite Zhou, Thomas Bieler, Tae-Kyu Lee, Wenjun Liu, Characterization of recrystallization and microstructure evolution in lead-free solder joints using EBSD and 3D-XRD, Journal of Electronic Materials, 42(2), 2013, 319-331

 

Tae-Kyu Lee, Bite Zhou, Thomas Bieler, Chien-Fu Tseng and Jeng-gong Duh, The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance, Journal of Electronic Materials, 42(2), 2013, 215-223

 

Hongtao Ma, Tae-Kyu Lee, The Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints, IEEE Transactions on Components and Packaging and Manufacturing Technology, 3(1), 2013, 71-78

 

Hongtao Ma, Tae-Kyu Lee, Dong-hyun Kim, H.G.Park, Sang-Ha Kim, KC Liu, Isothermal Aging Effects on the Mechanical Shock Performance of Lead-Free, IEEE Transactions on Components and Packaging and Manufacturing Technology, 1(5) 2011, 714-721

 

Tae-Kyu Lee, Bite Zhou and Thomas Bieler, Impact of isothermal aging and Sn grain orientation on the long-term reliability of wafer-level chip-scale package Sn-Ag-Cu solder interconnects, IEEE Transactions on Components and Packaging and Manufacturing Technology, 2(3), 2012, 496-501

 

Hyelim Choi, Tae-Kyu Lee, Yunsung Kim, Hoon Kwon, Chien-Fu Tseng, Jenq-Gong Duh, Heeman Choe, Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions, Intermetallics, 20(1), 2012, 155-159

 

Shao-Wei Fu, Chi-Yang Yu, Tae-Kyu Lee, Kuo-Chuan Liu, Jenq-Gong Duh , Impact crack propagation through the dual-phased (Cu,Ni)6Sn5 layer in Sn-Ag-Cu/Ni solder joints, Materials Letters, 80(1), 2012, 103–105

 

Chien-Fu Tseng, Tae-Kyu Lee, Gnyaneshwar Ramakrishna, Kuo-Chuan Liu, Jenq-Gong Duh , Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish, Materials Letters , 65(21-22), 2011, 3216–3218

 

Bite Zhou, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-Kyu Lee and Kuo-Chuan Liu, In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders, Journal of Electronic Materials, 41(2), 2012, 262-272

 

Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, P. Darbandi, F.Pourboghrat, Tae-Kyu Lee and Kuo-Chuan Liu, The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints, Journal of Electronic Materials, 41(2), 2012, 283-301

 

Tae-Kyu Lee, Bite Zhou, Thomas Bieler and Kuo-Chuan Liu, Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation, Journal of Electronic Materials, 41(2), 2012, 273-282

 

Bo Liu, Tae-Kyu Lee and Kuo-Chuan Liu, Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects, Journal of Electronic Materials, 40(10), 2011, 2111-2118 (corresponding author)

 

Tae-Kyu Lee, Weidong Xie, Bite Zhou, Thomas Bieler and Kuo-Chuan Liu, Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects, Journal of Electronic Material, 40(9), 2011, 1967-1976

 

Tae-Kyu Lee, Bo Liu, Bite Zhou, Thomas Bieler and Kuo-Chuan Liu, Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects, Journal of Electronic Materials, 40(9), 2011, 1895-1902

 

Bite Zhou, Thomas R. Bieler, Tae-kyu Lee and Kuo-Chuan Liu, Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface, Journal of Electronic Materials, 39(12), 2010, 2669-2679

 

Chi-Yang Yu, Tae-Kyu Lee, Michael Tsai, Kuo-Chuan Liu and Jenq-Gong Duh, Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures, Journal of Electronic Materials, 39(12), 2010, 2544-2552

 

Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu and Thomas Bieler, Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy, Journal of Electronic Materials, 39(12), 2010, 2588-2597

 

Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu and Jie Xue, Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects, Journal of Electronic Materials, 39(12), 2010, 2564-2573

 

Thomas Bieler, Tae-Kyu Lee and Kuo-Chuan Liu, Methodology for analyzing strain states during in-situ thermomechanical cycling in individual lead-free solder joints using Synchrotron radiation, Journal of Electronic Materials, 38(12), 2009, 2712-2719

 

Christopher Kinney, Tae-Kyu Lee, Kuo-Chuan Liu and J. W. Morris, The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects , Journal of Electronic Materials, 38(12), 2009, 2585-2591

 

Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee, Kuo-Chuan Liu, Methodology for analyzing slip behavior in ball grid array lead free solder joints after simple shear, Journal of Electronic Materials, 38(12), 2009, 2702-2711

 

Tae-Kyu Lee, Kuo-Chuan Liu and Thomas R. Bieler, Microstructure and orientation evolution of the sn phase as a function of position in ball grid arrays in Sn-Ag-Cu solder joints, Journal of Electronic Materials, 38(12), 2009, 2685-2693

 

Christopher Kinney, J.W. Morris, Tae-Kyu Lee, Kuo-Chuan Liu, Jie Xue and Dave Towne, The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder, Journal of Electronic Materials, 38(2), 2009, 221-226

 

Tae-Kyu Lee, Fay Hua and J.W.Morris, Jr., Heat effect and impact resistance during electromigration on Cu-Sn Interconnections, Electronic Materials Letters, 2(3), 2006, 157-160

 

D.M. Clatterbuck, Tae-Kyu Lee, T.J. Shaw, N.F. Heinig, Hsiao-Mei Cho, J. Clarke, J.W. Morris Jr, Detection of plastic deformation gradients in steel using scanning SQUID microscopy, IEEE Transactions on Applied Superconductivity, 4, 2001,1307-1310

 

Tae-Kyu Lee, H. J. Kim, B. Y. Kang, S. K. Hwang, Effect of Inclusion Size on the Nucleation of Acicular Ferrite in Welds, ISIJ International, 40(12), 2000, 1260-1268

 

Tae-Kyu Lee, E. I. Mosunov, S. K. Hwang, Consolidation of a gamma TiAl–Mn–Mo alloy by elemental powder metallurgy, Materials Science and Engineering A, 239-240, 1997, 540-545

 

Tae-Kyu Lee, J. H. Kim, and S. K. Hwang, Direct consolidation of γ-TiAl-Mn-Mo from elemental powder mixtures and control of porosity through a basic study of powder reactions, Metallurgical and Materials Transactions A, 28(12), 1997, 2723-2729

 

Tae-Kyu Lee, S.K. Hwang, S.W. Nam, and N.J. Kim, Control of beta phase in an EPM-processed intermetallic compound based on Ti-Al-Mn-Mo, Scripta Materialia, 36(11), 1997,1249-1254

 

 

Proceeding Papers

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Tae-Kyu Lee, Carly Rogan, and Gihan Dodanduwa Waduge, Young-Woo Lee,  Edward Ibe, and Karl Loh, Low Melting temperature solder interconnect behavior and thermal cycling performance enhancement using edgebond, Proceedings of SMTA International (2020), pp.81-86

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Arman Ahari, Omar Ahmed, Peng Su, Bernard Glasauer, Tengfei Jiang, and Tae-Kyu Lee, An Effective and Application-Specific Evaluation of Low-k Dielectric Integration Integrity using Copper Pillar Shear Testing, IEEE Proceedings, 70th Electronic Components and Technology Conference (ECTC) (2020), pp. 1517-1524

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Andy Hsiao, Edward Ibe, Karl Loh and Tae-Kyu Lee, Multi-axis loading effect on edgebond and edgefilled WLCSP thermal cycling performance, Proceedings of SMTA International (2019), pp.73-79

 

Keith Newman, Tae-Kyu Lee, Gek Joo Tan and Siew Kim Lim, Stress and Strain Level Evolution and Correlation to Void Migration in Solder Bumps after Various Thermo-mechanical Post Treatments, IEEE Proceedings, 2019 21st Electronics Packaging Technology Conference (EPTC), pp.570-573

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Omar Ahmed, Golareh Jalilvand, Hector Fernandez, Peng Su, Tae-Kyu Lee, and Tengfei Jiang, Long-Term Reliability of Solder Joints in 3D ICs under Near-Application, IEEE Proceedings, 69th Electronic Components and Technology Conference (ECTC) (2019), pp. 1106-1112

 

Mohamed Sheikh, Andy Hsiao, Weidong Xie, Steven Perng, Edward Ibe, Karl Loh and Tae-Kyu Lee, Multi-axis loading impact on thermo-mechanical stress-induced damage on WLCSP and components with via-in pad plated over (VIPPO) board design configuration, IEEE Proceedings, 68th Electronic Components and Technology Conference (ECTC) (2018), pp. 911-915

 

Imbok Lee, Aakash Valliappan, Young-Woo Lee, and Tae-Kyu Lee, Crack propagation mechanism study on Bismuth contained Sn base lead-free solder under thermo-mechanical stress, Proceedings of SMTA International (2018), pp.311-316

 

Andy Hsiao Mohamed Sheikh, Imbok Lee, Young-Woo Lee, Edward Ibe, Karl Loh and Tae-Kyu Lee, Low Melting Temperature interconnect thermal cycling performance enhancement using elemental tuning and edgebond application, Proceedings of SMTA International (2018), pp.173-178

 

Aruna Palaniappan, Li Li and Tae-Kyu Lee, Impact of press-fit connector pin microstructure elastic response to PCB through-hole Cu wall interface long-term contact reliability, IEEE Proceedings, 2018 20th Electronics Packaging Technology Conference (EPTC), pp.890-893

 

Vishnu V.B. Reddy, I. Charles Ume, Aaron Mebane, Chidinma Imediegwu, Kola Akinade, Amiya R. Chaudhuri, Bryan Rogers, Mark Hill, Cherif Guirguis, and Tae-Kyu Lee, Non-destructive Inspection of Flip-Chip BGA Solder Ball Defects Using Two Laser Beam Probe Ultrasonic Inspection Technique, IEEE Proceedings, 68th Electronic Components and Technology Conference (ECTC) (2018), pp. 764-770

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Indranath Dutta, Tae-Kyu Lee, and Hanry Yang, Effect of interfacial incompatibility on copper pumping and reliability of 3D devices, ASME INTERPACK Packaging and Integration of Electronic and Photonic Microsystems conference proceedings (2017), pp.142-147

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Andy Hsiao, Karl Loh, Kola Akinade and Tae-Kyu Lee, The Impact of conformal coating on WLCSP thermal cycle performance: Degradation mechanism and mitigation method, SMTA International (2017) Volume 1, pp. 745-750

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Tae-Kyu Lee, Weidong Xie, Steven Perng, Edward Ibe, and Karl Loh, Effect of local grain distribution and Enhancement on edgebond applied wafer-level chip-scale package (WLCSP) thermal cycling performance, IEEE Proceedings, 66th Electronic Components and Technology Conference (ECTC) (2016) pp.1502-1508

 

Tae-Kyu Lee, Kola Akinade, Cherif Guirgis, Weidong Xie, Steven Perng, Edward Ibe, and Karl Loh, Reworkable Edgebond applied wafer-level chip-scale package (WLCSP) thermal cycling performance enhancement at elevated temperature, SMTA International (2016) pp.120-126

 

Hanry Yang, Lutz Meinshausen, Tae-Kyu Lee, Indranath Dutta, Thermo-mechanically and electrically induced interfacial incompatibility in 3D packages with through silicon vias,15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (2016) pp.64-69

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Tae-Kyu Lee, Weidong Xie and Cherif Guirguis, Effect of elevated testing temperature on Sn-Ag-Cu interconnect high and low G board level mechanical shock performance, IEEE Proceedings, 65th Electronic Components and Technology Conference (ECTC) (2015) pp.1560-1565

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Steven Perng, Weidong Xie, Tae-Kyu Lee, and Cherif Guirguis, Innovative BGA Defect Detection Method for Transient Discontinuity, Proceedings of SMTA International (2015), pp.104-108

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Tae-Kyu Lee, Weidong Xie, Thomas R. Bieler and Choong-Un Kim, The impact of microstructure evolution, localized recrystallization and board thickness on Sn-Ag-Cu interconnect board level shock performance, IEEE Proceedings, 64th Electronic Components and Technology Conference (ECTC), Orlando,FL, 2014, 697 – 702

 

Huili Xu, Tae-Kyu Lee, Choong-Un Kim, Fatigue Properties of Lead-free Solder Joints in Electronic Packaging Assembly Investigated by Isothermal Cyclic Shear Fatigue, IEEE Proceedings, 64th Electronic Components and Technology Conference (ECTC) , Orlando,FL, 2014, 133 – 138

 

Huili Xu, Tae-Kyu Lee, Choong-Un Kim, Grain Structure Evolution and its Impact on the Fatigue Reliability of Lead-free Solder Joints in BGA Packaging Assembly, IEEE Proceedings, 63rd Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2013, 740 – 747

 

Weidong Xie, Tae-Kyu Lee, and Steven Perng, Systematic investigation of impact of SMT parameters, isothermal aging and alloy microstructure on Ob free BGA solder joint reliability, SMTA International, Orlando,FL, 2012

 

Huili Xu, W.H.Bang, Hongtao Ma, Tae-Kyu Lee, KC Liu, and ChoongUn Kim, Isothermal shear fatigue mechanism of lead free solder joints, IEEE Proceedings, 62th Electronic Components and Technology Conference (ECTC), San Diego,CA, 2012, 1299 – 1303

 

Huili Xu, W.H.Bang, Tae-Kyu Lee, and ChoongUn Kim, Sensitivity of grain structure and fatigue reliability of Pb-free solder joint on the position in BGA packaging assembly, IEEE Proceedings, 62th Electronic Components and Technology Conference (ECTC), San Diego,CA, 2012, 500 – 504

 

Tae-Kyu Lee and Hongtao Ma, Aging Impact on the Accelerated Thermal cycling Performance of Lead-free BGA Solder Joints in Various Stress Conditions, IEEE Proceedings, 62th Electronic Components and Technology Conference (ECTC), San Diego,CA, 2012, 477 – 482

 

R.Morusupalli, R.Rao, Tae-Kyu Lee, Yu-Lin Shen, M.Kunz, N.Tamura, A.Budiman, Critical temperature shift for Stress Induced Voiding in advanced Cu interconnects for 32 nm and beyond, IEEE Proceedings, International Reliability Physics Symposium (IRPS2012), Monterey, CA, 2012, EM.8.1 - EM.8.3

 

Tae-Kyu Lee, Weidong Xie, and Kuo-Chuan Liu, Impact of isothermal aging on Sn-Ag-Cu solder interconnect board level High G mechanical shock performance, IEEE Proceedings, 61st Electronic Components and Technology Conference (ECTC), Orlando,FL, 2011, 547 – 552

 

Weidong Xie, Tae-Kyu Lee, Kuo-Chuan Liu, and Jie Xue, Investigation on the failure criterion of reliability testing for Pb-free BGA packages         43rd International Symposium on Microelectronics (IMAPS 2010), Raileigh, NC, 2010

 

Tae-Kyu Lee, Weidong Xie, Thomas R. Bieler, Kuo-Chuan Liu and Jie Xue, Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnect, 43rd International Symposium on Microelectronics (IMAPS 2010), Raileigh, NC, 2010

           

Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, Farhang Pourboghrat, Tae-Kyu Lee, and Kuo-Chuan Liu, The Role of Elastic and Plastic Anisotropy of Sn on Microstructure and Damage Evolution in Lead-Free Solder joints, IEEE Proceedings, International Reliability Physics Symposium (IRPS2011), Monterey, CA, 2011, 5F.1.1-5F.1.9

 

Hongtao Ma, Kuo-Chuan Liu, Tae-Kyu Lee and Dong-hyun Kim, Effects of PCB design variations on bend and ATC performance of lead-free solder joints, IEEE, Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 1512 – 1517

 

Weidong Xie, Tae-Kyu Lee, Kuo-Chuan Liu, and Jie Xue, Pb-free solder joint reliability of fine pitch chip-scale packages, IEEE Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 1587-1590

 

Huili Xu, Woong-ho Bang, Hongtao Ma, Tae-Kyu Lee, KC Liu, Fracture mechanics of lead-free solder joints under cyclic shear load, IEEE Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 484-489

 

Anurag Bansal, Tae-Kyu Lee, Kuo-Chuan Liu, and Jie Xue, Effects of Isothermal Aging and In-Situ Current Stress on the Reliability of Lead-Free Solder Joints, IEEE Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 1529 – 1535

 

Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu Jie Xue and Thomas R. Bieler, The interaction between grain orientation evolution and thermal cycling as a function of position in ball grid arrays using Orientation Imaging Microscopy, IEEE Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 1591 – 1595

 

Bo Liu, Tae-Kyu Lee, and  Kuo-Chuan Liu, Environmental Conditions Impacts on Pb-Free Solder Joint Reliability, 42nd International Symposium on Microelectronics (IMAPS 2009) proceedings, San Jose, CA, 2009

 

Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu and Thomas R. Bieler, Grain Orientation and Microstructure Evolution in Sn-Ag-Cu solder joints as a Function of position in Ball grid array Packages, 42nd International Symposium on Microelectronics (IMAPS 2009) proceedings, San Jose, CA, 2009

           

Bite Zhou, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-kyu Lee, Kuo-Chuan Liu, Characterization of Microstructure and Internal Strain (stress) Evolution During Thermal Cycling, 42nd International Symposium on Microelectronics (IMAPS 2009) proceedings, San Jose, CA, 2009

 

Hongtao Ma, Tae-Kyu Lee, Dong Hyun Kim, Sang Ha Kim, Han G. Park, and Kuo-Chuan Liu, Isothermal Aging Effects on the Dynamic Performance of Lead-Free Solder Joints        IEEE Proceedings, 59th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2009, 390 – 397

 

Woong Ho Bang, Liang-Shan Chen, Choong-Un Kim, Tae-Kyu Lee and Kuo-Chuan Liu, Rate Dependence of Bending Fatigue Failure Characteristics of Lead-Free Solder Joint, IEEE Proceedings, 59th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2009, 2070-2074

 

Tae-Kyu Lee, J.W. Morris, Jr., Seungkyun Lee and John Clarke, Detection of fatigue damage prior to crack initiation with scanning SQUID microscopy, Review of Quantitative Nondestructive Evaluation, vol.25, 2006, 1378-1385

 

Tae-Kyu Lee, Fay Hua and J.W.Morris, Jr., Electromigration study on Cu-Sn interconnections, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, 2005, 60-62

 

Tae-Kyu Lee, J.W. Morris, Jr., Seungkyun Lee and John Clarke, Detecting incipient fatigue damage with scanning SQUID microscopy, Review of Quantitative Nondestructive Evaluation, vol.22, 2003, 485-91.

 

Tae-Kyu Lee, D.M. Clatterbuck, J.W. Morris, Jr., T.J. Shaw, Seungkyun Lee and John

Clarke, Detecting damage in steel with scanning SQUID microscopy, Review of Quantitative Nondestructive Evaluation, vol.21, 2002, 453-459

 

 

Invited Talks

 

Korea Institute of Industrial Technology (KITECH), Invited Talk, October 29, 2014, Incheon, Korea, The impact of microstructure evolution and Sn grain orientation on Lead-free solder interconnect long-term reliability, Tae-Kyu Lee

 

Korea Electronics Technology Institute (KETI), Invited Talk, October 2, 2014, Seoul, Korea, The impact of microstructure evolution and mechanical response on small and large BGA Sn-g-Cu interconnect board level shock performance, Tae-Kyu Lee

 

Hanyang University, MSE, Invited Talk, September 26, 2014, Seoul, Korea, What can a material scientist do in a world of Internet of everything (IoE), Tae-Kyu Lee

 

Washington State University MSE seminar series, Invited Talk, March 28, 2014, Pullman,WA, What can a Material Scientist do in a world of Internet of everything (IoE) : Looking into Sn microstructure to understand the Thermo-mechanical interconnect and joint reliability, Tae-Kyu Lee

 

SEMICON Korea Technology symposium, Invited Talk, February 13-14, 2014, Seoul, Korea, The impact and role of Grain orientation and Anisotropy of Sn in Recrystallization and Damage evolution in Sn-Ag-Cu interconnect reliability, Tae-Kyu Lee

 

SK Hynix R&D center, Invited Talk, February 11, 2014, Icheon, Korea, The impact of Sn anisotropy in solder reliability, recrystalization and damage evolution, Tae-Kyu Lee

 

Electronics and Telecommunications Research Institute (ETRI), Invited Talk, February 7, 2014, Daejeon, Korea, The role of elastic and plastic Anisotropy of Sn in recrystalization and damage evolution, Tae-Kyu Lee

 

Material Science and Engineering Department colloquium, University of California, Berkeley, Invited Talk, September 27, 2012, Berkeley, CA         , The impact of microstructure evolution and Sn grain orientation on Lead-free solder interconnect long-term reliability, Tae-Kyu Lee

 

141th TMS 2012 annual conference, Invited Talk, March11-15, 2012, Orlando,FL, The Impacts of Palladium Addition on Phase Formation, Microstructure Evolution and Mechanical Reliability in Sn-Ag-Cu/ENEPIG and Sn-Ag-Cu-Pd/ENIG Solder Joint, Chien Fu Tseng, I-Dai Wang, Tae-Kyu Lee, Kuo-Chuan Liu, Chih-Yuan Cheng, Jim Wang, Jeng-Gong Duh

 

141th TMS 2012 annual conference, invited talk, March11-15, 2012, Orlando,FL, Impact of Pd microalloy added Sn-Ag-Cu solder interconnect board level mechanical shock performance, Tae-Kyu Lee, Bite Zhou and Thomas Bieler

 

International Union of Materials Research Societies (IU-MRS) conference, invited talk, September20, 2011, Taipei, Taiwan, The impact of microstructure evolution and Sn grain orientation on lead-free solder interconnect long-term reliability, Tae-Kyu Lee, KC Liu, and T.R.Bieler

 

140th TMS 2011 annual conference, Invited Talk, February 27- March 3, 2011, San Diego, CA, Plasticity and Reliability: From Unexpected Plasticity-induced Damages in Advanced Cu Interconnects to Novel Reliability Phenomena in 3-D Interconnect Schemes using Through-Silicon Vias (TSV) Technology, Arief Budiman, Rao Morusupalli, Tae-Kyu Lee, Yu-Lin Shen

 

140th TMS 2011 annual conference, Invited talk, February 27- March 3, 2011, San Diego, CA, Impact of marine environment on long term reliability of wafer level packages with Sn-Pb and  Sn-Ag-Cu solder interconnects, Tae-Kyu Lee, Bo Liu, Kuo-Chuan Liu, Bite Zhou and Thomas R. Bieler

 

IEEE International Reliability Physics Symposium (IRPS2011), Invited Talk, April10-14, 2011, Monterey, CA, The Role of Elastic and Plastic Anisotropy of Sn on Microstructure and Damage Evolution in Lead-Free Solder joints, Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, Farhang Pourboghrat, Tae-Kyu Lee, and Kuo-Chuan Liu

 

139th TMS 2010 annual conference, Invited Talk, February 14-18, 2010, Seattle, WA, Impact of isothermal aging on long-term reliability of fine pitch ball grid array package with Sn-Ag-Cu solder interconnects, Tae-Kyu Lee, Weidong Xie, Kuo-Chuan Liu and Thomas R. Bieler

 

139th TMS 2010 annual conference, Invited Talk, February 14-18, 2010, Seattle, WA, The interaction between imposed current and creep of idealized Sn-Ag-Cu solder interconnects, J.W.Morris, Jr. Christopher  Kinney, Xio Linares, and Tae-Kyu Lee

 

MS&T Conference, Invited Talk, October 25-29, 2009, Pittsburgh, PA, Interactions between Deformation Mechanisms, Microstructure, and Thermal Cycling in Lead-Free Solder Joints, Thomas Bieler; Tae-kyu Lee; Kuo-Chuan Liu

                                                                       

5th TMS 2009 Lead free solder and technology workshop, Invited Talk, February 15, 2009, San Francisco, CA, The influence of imposed current on the creep of Sn rich Pb-free solder, J.W. Morris, Jr., Chris Kinney and Tae-Kyu Lee

 

5th TMS 2009 Lead free solder and technology workshop, Invited Talk          , February 15, 2009, San Francisco, CA, The role of elastic and plastic anisotropy on damage nucleation in lead-free solder joints, Thomas R. Bieler and Tae-Kyu Lee