Sunday, March 23rd,13:00-17:30
MGM Grand Las Vegas Hotel and Casino, room 103
Electronic Packaging and Interconnection Materials Committee (EPIM)

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13:00  

Welcome and Introduction to the Workshop

Prof. Albert Wu (National Central University, Taiwan)

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13:10

The advanced packaging landscape of High performance chips (HPC) and AI network system interconnection

Dr. Tae-Kyu Lee (Cisco Systems)

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14:00

Sn-Bi LTS Technology : Past, Present and Future

Dr. Raiyo Aspandiar (Intel)

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15:00   Break

 

​15:20

Exploration of Lower Temperature Soldering for Large BGA Assembly

Dr. Hongwen Zhang (Indium Corporation)

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16:20

Recent Knowledge gain and mechanism study in the field of Sn-Bi and Sn-In alloy system

Prof. Kazuhiro Nogita (University of Queensland)

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17:20

Closing Remark

Workshop organizers : Prof. Albert Wu, Prof. Kazuhiro Nogita and Dr. Tae-Kyu Lee